Inventor · disambiguated record
Howard R. Test
Also filed as: TEST HOWARD · TEST HOWARD R · TEST HOWARD RAEBURN · TEST II HOWARD R
17 granted patents·9 pending applications·830 citations·filing 1980–2008
95Inventor score
Top patents by PatentIndex Score
26 records- 0198US6800555B2Wire bonding process for copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 5, 2004·185 cites·9 claims
- 0298US6616967B1Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating processTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 9, 2003·272 cites·12 claims
- 0393US6268662B1Wire bonded flip-chip assembly of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 31, 2001·154 cites·17 claims
- 0479US7535104B2Structure and method for bond pads of copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 19, 2009·7 cites·14 claims
- 0576US4388696AData processing system having dual output modesTEXAS INSTRUMENTS INC·Filed 1980·Granted Jun 14, 1983·32 cites·7 claims
- 0674US7413974B2Copper-metallized integrated circuits having electroless thick copper bond padsTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 19, 2008·5 cites·9 claims
- 0774US4874722AProcess of packaging a semiconductor device with reduced stress forcesTEXAS INSTRUMENTS INC·Filed 1988·Granted Oct 17, 1989·47 cites·8 claims
- 0871US4423435AAssembly of an electronic device on an insulative substrateTEXAS INSTRUMENTS INC·Filed 1980·Granted Dec 27, 1983·32 cites·10 claims
- 0970US5544804ACapillary designs and process for fine pitch ball bondingTEXAS INSTRUMENTS INC·Filed 1994·Granted Aug 13, 1996·51 cites·10 claims
- 1068US7217656B2Structure and method for bond pads of copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2005·Granted May 15, 2007·3 cites·12 claims
- 1162US7265443B2Wire bonded semiconductor device having low inductance and noiseTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 4, 2007·2 cites·13 claims
- 1257US6068180ASystem, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframeTEXAS INSTRUMENTS INC·Filed 1997·Granted May 30, 2000·23 cites·18 claims
- 1352US8530279B2Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoterTEST HOWARD RAEBURN·Filed 2008·Granted Sep 10, 2013·1 cites·12 claims
- 1451US2008274294A1Copper-metallized integrated circuits having electroless thick copper bond padsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1549US5979743AMethod for making an IC device using a single-headed bonderTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 9, 1999·15 cites·18 claims
- 1649US2008026562A1Novel Metallization Scheme and Method of Manufacture ThereforTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1747US7294923B2Metallization scheme including a low modulus structureTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 13, 2007·0 cites·9 claims
- 1845US6869875B2Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating processTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 22, 2005·1 cites·7 claims
- 1941US2005106851A1Wire bonding process for copper-metallized integrated circuitsFiled 2004·Application pending·0 cites
- 2039US2008157300A1Thermally Enhanced IC Package and MethodCHUANG SHIH-FANG·Filed 2007·Application pending·0 cites
- 2138US6619538B1Nickel plating process having controlled hydrogen concentrationTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 16, 2003·0 cites·9 claims
- 2238US2004018675A1Nickel plating process having controlled hydrogen concentrationFiled 2003·Application pending·0 cites
- 2338US2003071319A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2002·Application pending·0 cites
- 2437US2001033020A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2001·Application pending·0 cites
- 2537US2005133928A1Wire loop grid array packageFiled 2003·Application pending·0 cites
- 2634US2003107137A1Micromechanical device contact terminals free of particle generationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →