Inventor · disambiguated record
Holger Torwesten
Also filed as: TORWESTEN HOLGER
12 granted patents·2 pending applications·22 citations·filing 2004–2018
86Inventor score
Files withINFINEON TECHNOLOGIES AG5HELNEDER JOHANN2SCHNEEGANS MANFRED2TORWESTEN HOLGER2BINDER FLORIAN1
Top patents by PatentIndex Score
14 records- 0188US8367514B2Integrated circuit with capacitor and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2010·Granted Feb 5, 2013·9 cites·4 claims
- 0270US7692266B2Integrated circuit with capacitor and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 6, 2010·3 cites·14 claims
- 0369US9245868B2Method for manufacturing a chip packageTORWESTEN HOLGER·Filed 2012·Granted Jan 26, 2016·3 cites·25 claims
- 0464US10964642B2Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common planeINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 30, 2021·1 cites·4 claims
- 0564US8945990B2Chip package and method of forming the sameTORWESTEN HOLGER·Filed 2012·Granted Feb 3, 2015·2 cites·9 claims
- 0658US8264072B2Electronic deviceSCHNEEGANS MANFRED·Filed 2007·Granted Sep 11, 2012·1 cites·16 claims
- 0758US8263491B2Substrate with feedthrough and method for producing the sameBINDER FLORIAN·Filed 2007·Granted Sep 11, 2012·3 cites·17 claims
- 0850US8709876B2Electronic deviceSCHNEEGANS MANFRED·Filed 2012·Granted Apr 29, 2014·0 cites·12 claims
- 0949US7755190B2Electronic device including a nickel-palladium alloy layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 13, 2010·0 cites·31 claims
- 1042US9214442B2Power semiconductor module, method for producing a power semiconductor module, and semiconductor chipGUTH KARSTEN·Filed 2007·Granted Dec 15, 2015·0 cites·20 claims
- 1141US10192849B2Semiconductor modules with semiconductor dies bonded to a metal foilINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 29, 2019·0 cites·20 claims
- 1241US9553051B2Electronic componentINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Jan 24, 2017·0 cites·20 claims
- 1340US2007114662A1Interconnecting element between semiconductor chip and circuit support and methodHELNEDER JOHANN·Filed 2006·Application pending·0 cites
- 1435US2007246133A1Method for Electroplating and Contact Projection ArrangementHELNEDER JOHANN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →