Inventor · disambiguated record
Hong-Hsiang Tsai
Also filed as: TSAI HONG-HSIANG
6 granted patents·108 citations·filing 1995–2009
83Inventor score
Top patents by PatentIndex Score
6 records- 0179US5763306AMethod of fabricating capacitor over bit line COB structure for a very high density DRAM applicationsVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Jun 9, 1998·52 cites·32 claims
- 0269US6352896B1Method of manufacturing DRAM capacitorWINBOND ELECTRONICS CORP·Filed 2000·Granted Mar 5, 2002·13 cites·26 claims
- 0361US5917748AMulti-level DRAM sensing schemeVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Jun 29, 1999·23 cites·11 claims
- 0457US6423594B1Method of fabricating deep trench capacitorWINBOND ELECTRONICS CORP·Filed 2001·Granted Jul 23, 2002·7 cites·10 claims
- 0549US5691213ALow capacitance input/output integrated circuitVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Nov 25, 1997·12 cites·11 claims
- 0641US8072067B2Semiconductor structureCHIAN MING-CHUNG·Filed 2009·Granted Dec 6, 2011·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →