Inventor · disambiguated record
Ho-Hsiang Wang
Also filed as: WANG HO-HSIANG
1 granted patent·2 pending applications·0 citations·filing 2008–2022
4Inventor score
Top patents by PatentIndex Score
3 records- 0148US11740504B1Curved panel and manufacturing method thereofAUO CORP·Filed 2022·Granted Aug 29, 2023·0 cites·13 claims
- 0245US2009236772A1Pattern transfer mold and pattern transfer methodCOMPAL ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 0342US2009194908A1Mold for injection molding and an injection molding device/method with surface quality improvement abilityUNIV CHUNG YUAN CHRISTIAN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →