Inventor · disambiguated record
Hong Bok We
Also filed as: WE HONG BOK
81 granted patents·76 pending applications·440 citations·filing 2009–2024
98Inventor score
Top patents by PatentIndex Score
157 records- 0199US9443824B1Cavity bridge connection for die split architectureQUALCOMM INC·Filed 2015·Granted Sep 13, 2016·102 cites·20 claims
- 0299US9368450B1Integrated device package comprising bridge in litho-etchable layerQUALCOMM INC·Filed 2015·Granted Jun 14, 2016·119 cites·30 claims
- 0397US9633977B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·32 cites·31 claims
- 0496US11682607B2Package having a substrate comprising surface interconnects aligned with a surface of the substrateQUALCOMM INC·Filed 2021·Granted Jun 20, 2023·8 cites·16 claims
- 0596US10410971B2Thermal and electromagnetic interference shielding for die embedded in package substrateQUALCOMM INC·Filed 2017·Granted Sep 10, 2019·37 cites·30 claims
- 0696US9679855B1Polymer crack stop seal ring structure in wafer level packageQUALCOMM INC·Filed 2016·Granted Jun 13, 2017·20 cites·21 claims
- 0795US11183446B1X.5 layer substrateQUALCOMM INC·Filed 2020·Granted Nov 23, 2021·4 cites·28 claims
- 0895US9401350B1Package-on-package (POP) structure including multiple diesQUALCOMM INC·Filed 2015·Granted Jul 26, 2016·13 cites·14 claims
- 0994US9595496B2Integrated device package comprising silicon bridge in an encapsulation layerQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·17 cites·21 claims
- 1093US9642259B2Embedded bridge structure in a substrateQUALCOMM INC·Filed 2013·Granted May 2, 2017·18 cites·30 claims
- 1193US9583462B2Damascene re-distribution layer (RDL) in fan out split die applicationQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·10 cites·10 claims
- 1287US10157823B2High density fan out package structureQUALCOMM INC·Filed 2015·Granted Dec 18, 2018·6 cites·17 claims
- 1386US11444019B2Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the packageQUALCOMM INC·Filed 2020·Granted Sep 13, 2022·2 cites·28 claims
- 1486US9633950B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·5 cites·30 claims
- 1586US9613942B2Interposer for a package-on-package structureQUALCOMM INC·Filed 2015·Granted Apr 4, 2017·5 cites·28 claims
- 1683US9596768B2Substrate with conductive viasQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·6 cites·23 claims
- 1782US11594491B2Multi-die interconnectQUALCOMM INC·Filed 2021·Granted Feb 28, 2023·1 cites·24 claims
- 1882US10403707B2Array type inductorQUALCOMM INC·Filed 2017·Granted Sep 3, 2019·2 cites·24 claims
- 1980US11545425B2Substrate comprising interconnects embedded in a solder resist layerQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·1 cites·24 claims
- 2080US10181410B2Integrated circuit package comprising surface capacitor and ground planeQUALCOMM INC·Filed 2015·Granted Jan 15, 2019·3 cites·18 claims
- 2179US11289453B2Package comprising a substrate and a high-density interconnect structure coupled to the substrateQUALCOMM INC·Filed 2020·Granted Mar 29, 2022·1 cites·27 claims
- 2279US9595494B2Semiconductor package with high density die to die connection and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 14, 2017·3 cites·11 claims
- 2378US9502490B2Embedded package substrate capacitorQUALCOMM INC·Filed 2014·Granted Nov 22, 2016·4 cites·14 claims
- 2478US9355963B2Semiconductor package interconnections and method of making the sameQUALCOMM INC·Filed 2014·Granted May 31, 2016·4 cites·30 claims
- 2578US9230936B2Integrated device comprising high density interconnects and redistribution layersQUALCOMM INC·Filed 2014·Granted Jan 5, 2016·4 cites·24 claims
- 2677US9659850B2Package substrate comprising capacitor, redistribution layer and discrete coaxial connectionQUALCOMM INC·Filed 2014·Granted May 23, 2017·4 cites·19 claims
- 2774US2024421105A1Inkjet printing dedicated test pinsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2873US9799628B2Stacked package configurations and methods of making the sameQUALCOMM INC·Filed 2016·Granted Oct 24, 2017·2 cites·14 claims
- 2972US2024363514A1Package comprising a package substrate that includes an encapsulated portion with interconnection portion blocksQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3070US9385077B2Integrated device comprising coaxial interconnectQUALCOMM INC·Filed 2014·Granted Jul 5, 2016·2 cites·29 claims
- 3169US2024363513A1Package comprising a package substrate that includes an encapsulated portion with interconnection portion blocksQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3268US9490226B2Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signalQUALCOMM INC·Filed 2014·Granted Nov 8, 2016·1 cites·33 claims
- 3367US9628052B2Embedded multi-terminal capacitorQUALCOMM INC·Filed 2014·Granted Apr 18, 2017·2 cites·29 claims
- 3463US9583433B2Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layerQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·1 cites·20 claims
- 3562US9881859B2Substrate block for PoP packageQUALCOMM INC·Filed 2014·Granted Jan 30, 2018·1 cites·25 claims
- 3661US12500146B2Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·23 claims
- 3761US12381174B2Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Aug 5, 2025·0 cites·23 claims
- 3861US2025293136A1Buried bump structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3961US2025132262A1Device with side-by-side integrated circuit devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4060US2025273626A1Package comprising integrated devices and an interconnection deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4160US2025253217A1Package comprising substrates with post interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4260US2025294685A1Substrate with buried glass coreQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4360US2025300056A1Integrated device with conductive pillar structure for die interconnectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4460US2022320016A1Inkjet printing dedicated test pinsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4560US2025273522A1Package comprising a substrate including a via interconnect with a partial concentric planar cross sectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4660US2025183178A1Bridge die in substrate core layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4759US2025098066A1Package comprising a substrate with an interconnect blockQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4858US11749611B2Package with a substrate comprising periphery interconnectsQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·23 claims
- 4958US2025062246A1Structure for delamination mitigation in a semiconductor deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 5058US2025096091A1Package comprising a substrate with via interconnect with vertical wallsQUALCOMM INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 157 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →