Inventor · disambiguated record
Holger Woerner
Also filed as: WOERNER HOLGER
26 granted patents·2 pending applications·595 citations·filing 2002–2007
96Inventor score
Top patents by PatentIndex Score
28 records- 0197US7545047B2Semiconductor device with a wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 9, 2009·78 cites·17 claims
- 0296US7202107B2Method for producing a semiconductor component with a plastic housing and carrier plate for performing the methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 10, 2007·108 cites·9 claims
- 0394US7482198B2Method for producing through-contacts and a semiconductor component with through-contactsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 27, 2009·38 cites·9 claims
- 0493US7622733B2Semiconductor structure with a plastic housing and separable carrier plateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 24, 2009·32 cites·18 claims
- 0591US6902951B2Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 7, 2005·67 cites·6 claims
- 0689US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 0789US7456495B2Semiconductor module with a semiconductor stack, and methods for its productionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 25, 2008·79 cites·19 claims
- 0887US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 0982US7091595B2Semiconductor device with semiconductor chip and rewiring layer and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 15, 2006·29 cites·8 claims
- 1079US7638418B2Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 29, 2009·8 cites·8 claims
- 1179US7009288B2Semiconductor component with electromagnetic shielding deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 7, 2006·31 cites·16 claims
- 1273US7883993B2Semiconductor device with semiconductor chip and rewiring layer and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 8, 2011·5 cites·13 claims
- 1373US7408241B2Semiconductor device with a recessed bond padINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 5, 2008·5 cites·19 claims
- 1470US7514273B2Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panelQIMONDA AG·Filed 2004·Granted Apr 7, 2009·12 cites·23 claims
- 1569US8659135B2Semiconductor device stack and method for its productionBAUER MICHAEL·Filed 2005·Granted Feb 25, 2014·5 cites·8 claims
- 1665US7516543B2Method for manufacturing semiconductor component with a media channelINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·3 cites·11 claims
- 1763US7692283B2Device including a housing for a semiconductor chip including leads extending into the housingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 6, 2010·2 cites·17 claims
- 1858US7893532B2External contact material for external contacts of a semiconductor device and method of making the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 22, 2011·1 cites·13 claims
- 1954US7190059B2Electronic component with a stack of semiconductor chips and a method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 13, 2007·6 cites·19 claims
- 2051US7700956B2Sensor component and panel used for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 20, 2010·4 cites·8 claims
- 2150US7524699B2Electronic component and a panelINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 28, 2009·4 cites·4 claims
- 2249US7772105B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·0 cites·8 claims
- 2348US7566968B2Biosensor with smart card configurationSIEMENS AG·Filed 2005·Granted Jul 28, 2009·0 cites·10 claims
- 2447US7391103B2Electronic module having plug contacts and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 24, 2008·2 cites·21 claims
- 2546US7327023B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·0 cites·12 claims
- 2645US2005184375A1Electronic device configured as a multichip module, leadframe and panel with leadframe positionsINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2743US7528054B2Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 5, 2009·0 cites·13 claims
- 2842US2006255435A1Method for encapsulating a semiconductor device and semiconductor deviceFUERGUT EDWARD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →