Inventor · disambiguated record
Holger Wörner
Also filed as: WOERNER HOLGER · WORNER HOLGER
6 granted patents·3 pending applications·170 citations·filing 2002–2006
85Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
9 records- 0190US6710455B2Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·65 cites·15 claims
- 0286US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 0382US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 0480US6683374B2Electronic component and process for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·30 cites·15 claims
- 0579US7064429B2Electronic package having integrated cooling element with clearance for engaging packageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 20, 2006·28 cites·24 claims
- 0643US6953992B2Electronic component with at least one semiconductor chip and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 11, 2005·1 cites·8 claims
- 0739US2004043515A1Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housingFiled 2003·Application pending·0 cites
- 0835US2003042591A1Electronic component with at least two stacked semiconductor chips, and fabrication methodFiled 2002·Application pending·0 cites
- 0935US2003043555A1Electronic component with at least two stacked semiconductor chips and process for producing the electronic componentFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →