Inventor · disambiguated record
Hong Xie
Also filed as: XIE HONG · XIE HONG-HIU
36 granted patents·2 pending applications·1,374 citations·filing 1994–2021
98Inventor score
Top patents by PatentIndex Score
38 records- 0196US5880524AHeat pipe lid for electronic packagesINTEL CORP·Filed 1997·Granted Mar 9, 1999·309 cites·38 claims
- 0292US5883782AApparatus for attaching a heat sink to a PCB mounted semiconductor packageINTEL CORP·Filed 1997·Granted Mar 16, 1999·201 cites·10 claims
- 0390US5513070ADissipation of heat through keyboard using a heat pipeINTEL CORP·Filed 1994·Granted Apr 30, 1996·161 cites·19 claims
- 0489US6166908AIntegrated circuit cartridgeINTEL CORP·Filed 1999·Granted Dec 26, 2000·84 cites·26 claims
- 0588US7133294B2Integrated circuit packages with sandwiched capacitorsINTEL CORP·Filed 2005·Granted Nov 7, 2006·16 cites·24 claims
- 0687US5990552AApparatus for attaching a heat sink to the back side of a flip chip packageINTEL CORP·Filed 1997·Granted Nov 23, 1999·105 cites·26 claims
- 0785US6563703B2Portable and plugable thermal and power solution for a notebook or handheld deviceINTEL CORP·Filed 2000·Granted May 13, 2003·47 cites·6 claims
- 0883US7332423B2Soldering a die to a substrateINTEL CORP·Filed 2005·Granted Feb 19, 2008·14 cites·12 claims
- 0983US7045890B2Heat spreader and stiffener having a stiffener extensionINTEL CORP·Filed 2001·Granted May 16, 2006·35 cites·67 claims
- 1083US5621613AApparatus for dissipating heat in a hinged computing deviceINTEL CORP·Filed 1996·Granted Apr 15, 1997·118 cites·25 claims
- 1181US7578678B2Protected socket for integrated circuit devicesINTEL CORP·Filed 2007·Granted Aug 25, 2009·8 cites·16 claims
- 1280US6558169B2Shunt power connection for an integrated circuit packageINTEL CORP·Filed 2001·Granted May 6, 2003·24 cites·26 claims
- 1378US6493223B1Computer utilizing refrigeration for coolingINTEL CORP·Filed 2000·Granted Dec 10, 2002·27 cites·17 claims
- 1476US6575766B1Laminated socket contactsINTEL CORP·Filed 2002·Granted Jun 10, 2003·20 cites·22 claims
- 1575US6900991B2Electronic assembly with sandwiched capacitors and methods of manufactureINTEL CORP·Filed 2001·Granted May 31, 2005·20 cites·42 claims
- 1675US5699227AHeat pipe to baseplate attachment methodINTEL CORP·Filed 1996·Granted Dec 16, 1997·42 cites·15 claims
- 1774US6821823B2Molded substrate stiffener with embedded capacitorsINTEL CORP·Filed 2003·Granted Nov 23, 2004·15 cites·10 claims
- 1872US5949647AHeat pipe to baseplate attachment methodINTEL CORP·Filed 1997·Granted Sep 7, 1999·37 cites·4 claims
- 1968US6710444B2Molded substrate stiffener with embedded capacitorsINTEL CORP·Filed 2002·Granted Mar 23, 2004·11 cites·16 claims
- 2062US6853061B2Dual power supply method and apparatusINTEL CORP·Filed 2002·Granted Feb 8, 2005·10 cites·13 claims
- 2160US7510418B1Loading mechanisms for integrated circuit (IC) packagesINTEL CORP·Filed 2007·Granted Mar 31, 2009·7 cites·7 claims
- 2258US7316573B2Protected socket for integrated circuit devicesINTEL CORP·Filed 2004·Granted Jan 8, 2008·6 cites·27 claims
- 2356US6256199B1Integrated circuit cartridge and method of fabricating the sameINTEL CORP·Filed 1999·Granted Jul 3, 2001·24 cites·20 claims
- 2453US11762483B2Mouse devicePRIMAX ELECTRONICS LTD·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 2553US10044115B2Universal linear edge connectorINTEL CORP·Filed 2015·Granted Aug 7, 2018·1 cites·7 claims
- 2653US9860988B2Solder contacts for socket assembliesINTEL CORP·Filed 2014·Granted Jan 2, 2018·0 cites·24 claims
- 2751US10321573B2Solder contacts for socket assembliesINTEL CORP·Filed 2017·Granted Jun 11, 2019·0 cites·22 claims
- 2849US6854979B2Laminated socket contactsINTEL CORP·Filed 2002·Granted Feb 15, 2005·3 cites·15 claims
- 2948US6011696ACartridge and an enclosure for a semiconductor packageINTEL CORP·Filed 1998·Granted Jan 4, 2000·13 cites·19 claims
- 3047US7161243B2System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power deliveryINTEL CORP·Filed 2005·Granted Jan 9, 2007·0 cites·10 claims
- 3147US6979208B2Laminated socket contactsINTEL CORP·Filed 2004·Granted Dec 27, 2005·3 cites·18 claims
- 3246US6992378B2Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power deliveryINTEL CORP·Filed 2000·Granted Jan 31, 2006·2 cites·21 claims
- 3346US6672880B2Laminated socket contactsINTEL CORP·Filed 2002·Granted Jan 6, 2004·2 cites·24 claims
- 3441US2008116589A1Ball grid array package assembly with integrated voltage regulatorLI ZONG-FU·Filed 2006·Application pending·0 cites
- 3540US6672891B2Zero insertion force connector for substrates with edge contactsINTEL CORP·Filed 2001·Granted Jan 6, 2004·1 cites·22 claims
- 3639US5956229AInjection molded thermal interface systemINTEL CORP·Filed 1998·Granted Sep 21, 1999·8 cites·11 claims
- 3735US11387619B2Micro-optical bench architecture for master oscillator power amplifier (MOPA)ITF TECH INC·Filed 2020·Granted Jul 12, 2022·0 cites·30 claims
- 3830US2017287873A1Electronic assembly components with corner adhesive for warpage reduction during thermal processingSANKARASUBRAMANIAN SANTOSH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →