Inventor · disambiguated record
Hongfei Yan
Also filed as: YAN HONGFEI
6 granted patents·4 pending applications·32 citations·filing 2000–2024
71Inventor score
Top patents by PatentIndex Score
10 records- 0177US6447322B1Test socket for an electronic assembly which reduces damage to the electronic assemblyINTLE CORP·Filed 2000·Granted Sep 10, 2002·32 cites·21 claims
- 0255US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
- 0345US11259399B2Socket with thermal conductorINTEL CORP·Filed 2018·Granted Feb 22, 2022·0 cites·18 claims
- 0445US10318396B2Technologies for temperature measurement of a processorINTEL CORP·Filed 2015·Granted Jun 11, 2019·0 cites·25 claims
- 0543US10211120B2Rework grid array interposer with direct powerINTEL CORP·Filed 2015·Granted Feb 19, 2019·0 cites·21 claims
- 0639US8528960B2Vehicle roof retracting device and vehicle having the sameMAO DEHE·Filed 2009·Granted Sep 10, 2013·0 cites·34 claims
- 0739US7521949B2Test pin, method of manufacturing same, and system containing sameINTEL CORP·Filed 2007·Granted Apr 21, 2009·0 cites·11 claims
- 0834US2014187058A1Modular Multiple Piece Socket For Enhanced Thermal ManagementYAN HONGFEI·Filed 2012·Application pending·0 cites
- 0932US2017178994A1Integrated circuit package support structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1026US2011227365A1Retractable vehicle roof apparatus and vehicle having the sameMAO DEHE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →