Inventor · disambiguated record
Hong Seung Yeon
Also filed as: YEON HONG SEUNG
1 granted patent·4 pending applications·0 citations·filing 2022–2023
10Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0157US12400363B2Device and method for improved fiducial marker detectionINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0253US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0352US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0452US2025218885A1Patterned mold underfill (muf) films for deep trench fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 0546US2024178151A1Overlying fiducial design for glass placement accuracy improvementINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →