Inventor · disambiguated record
Hongsheng Yi
Also filed as: YI HONGSHENG
5 granted patents·1 pending application·0 citations·filing 2019–2024
58Inventor score
Top patents by PatentIndex Score
6 records- 0153US2024213322A1Field effect transistor, preparation method thereof, and electronic circuitHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0250US11587838B2Grinding control method and device for wafer, and grinding deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Feb 21, 2023·0 cites·17 claims
- 0347US12368110B2Wafer assembly having alignment marks, method for forming same, and wafer alignment methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Jul 22, 2025·0 cites·20 claims
- 0445US11227760B2Wafer thinning method and wafer structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jan 18, 2022·0 cites·13 claims
- 0544US12506095B2Wafer bonding structure, wafer bonding method and chip bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Dec 23, 2025·0 cites·16 claims
- 0640US11164840B2Chip interconnection structure, wafer interconnection structure and method for manufacturing the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 2, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →