Inventor · disambiguated record
Hongwon Yoon
Also filed as: YOON HONGWON
3 granted patents·1 pending application·4 citations·filing 2021–2023
58Inventor score
Technology areasA61F
Top patents by PatentIndex Score
4 records- 0191US11291559B1Expandable interbody fusion device and method of manufacturing the sameCTL AMEDICA CORP·Filed 2021·Granted Apr 5, 2022·3 cites·23 claims
- 0283US11730606B2Expandable bi-dimensional interbody and method of manufacturing the sameCTL AMEDICA CORP·Filed 2021·Granted Aug 22, 2023·1 cites·20 claims
- 0367US12458508B2Expandable interbody fusion deviceCTL AMEDICA CORP·Filed 2022·Granted Nov 4, 2025·0 cites·18 claims
- 0464US2023346569A1Expandable bi-dimensional interbody and method of manufacturing the sameCTL BIOTEC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →