Inventor · disambiguated record
Hong-Chi Yu
Also filed as: YU HONG · YU HONG-CHI
35 granted patents·57 pending applications·309 citations·filing 2003–2025
96Inventor score
Files withWALTON ADVANCED ENG INC66YU HONG-CHI22GLOBALFOUNDRIES SG PTE LTD2JIANGXI HONGJIUCHANG CONSTRUCTION & INSTALLATION ENG CO LTD1OMNIDIRECTIONAL CONTROL TECHNO1
Top patents by PatentIndex Score
92 records- 0197US6763410B2Portable universal serial bus memory deviceWALTON ADVANCED ENG INC·Filed 2003·Granted Jul 13, 2004·174 cites·9 claims
- 0289US7887342B1Structure having an USB memory moduleWALTON ADVANCED ENG INC·Filed 2010·Granted Feb 15, 2011·12 cites·17 claims
- 0387US7903408B1Heat dissipation device of electronic circuit modulesWALTON ADVANCED ENG INC·Filed 2009·Granted Mar 8, 2011·16 cites·50 claims
- 0486US10515236B1Data retention deviceWALTON ADVANCED ENG INC·Filed 2019·Granted Dec 24, 2019·5 cites·7 claims
- 0586USD737820SNetwork storage deviceWALTON ADVANCED ENG INC·Filed 2014·Granted Sep 1, 2015·36 cites·1 claims
- 0685US7270557B1High-density storage deviceWALTON ADVANCED ENG INC·Filed 2006·Granted Sep 18, 2007·15 cites·9 claims
- 0784US8498105B2USB device structureYU HONG-CHI·Filed 2010·Granted Jul 30, 2013·7 cites·12 claims
- 0883US9287197B2Through silicon viasGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Mar 15, 2016·6 cites·20 claims
- 0975US9437547B2Through silicon viasGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Sep 6, 2016·2 cites·20 claims
- 1071US8488310B2Thin data storage deviceYU HONG-CHI·Filed 2011·Granted Jul 16, 2013·3 cites·14 claims
- 1170US7413470B1Modular assembly of memory module packagesWALTON ADVANCED ENG INC·Filed 2007·Granted Aug 19, 2008·5 cites·6 claims
- 1268US8770997B2Foldable USB connectorWALTON ADVANCED ENG INC·Filed 2012·Granted Jul 8, 2014·6 cites·12 claims
- 1365US8414335B2USB portYU HONG-CHI·Filed 2011·Granted Apr 9, 2013·5 cites·8 claims
- 1464US8675366B2Cascade data storage deviceYU HONG-CHI·Filed 2011·Granted Mar 18, 2014·1 cites·9 claims
- 1562US7311460B2Digital data storage device mounted in a pen shaped housingWALTON ADVANCED ENG INC·Filed 2003·Granted Dec 25, 2007·9 cites·9 claims
- 1661USD1041877SPlayer caseJIANGXI HONGJIUCHANG CONSTRUCTION & INSTALLATION ENG CO LTD·Filed 2024·Granted Sep 17, 2024·2 cites·1 claims
- 1761US2025349767A1Semiconductor package structure with improved die pad and method thereofWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 1858US2024421137A1Chip package unit, chip package stack module, and method of manufacturing chip package stack moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 1958US2024321653A1Wafer package for protection of aluminum die pad of die from damages during probe testing processWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2057US12355730B2Method for construction of a high-security private group networkWALTON ADVANCED ENG INC·Filed 2023·Granted Jul 8, 2025·0 cites·8 claims
- 2157US7795720B1Inversely alternate stacked structure of integrated circuit modulesWALTON ADVANCED ENG INC·Filed 2009·Granted Sep 14, 2010·1 cites·27 claims
- 2257US2024266239A1Chip package unit with outer protective layer and method of manufactuirng the sameWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2357US2024260195A1Embedded dual in-line memory moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2456US7957130B2Attached-type memory deviceWALTON ADVANCED ENG INC·Filed 2009·Granted Jun 7, 2011·2 cites·7 claims
- 2556US2024243075A1Chip package with heat dissipation and electromagnetic protectionWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2656US2024162164A1Chip package with metal shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2755US2024372902A1Metaverse Implementation MethodWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2855US2020265434A1Transaction authentication methodWALTON ADVANCED ENG INC·Filed 2019·Application pending·0 cites
- 2955US2024120300A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3055US2020264793A1Method to change the capacity of a storage deviceWALTON ADVANCED ENG INC·Filed 2019·Application pending·0 cites
- 3155US2024088057A1Chip package with electromagnetic interference (emi) shielding layer and ground wire and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3255US2024096758A1Chip package having die pad with protective layerWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3355US2024145404A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3454US12512448B2Multi-layer stacked chip packageWALTON ADVANCED ENG INC·Filed 2023·Granted Dec 30, 2025·0 cites·5 claims
- 3554US12482771B2Chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Granted Nov 25, 2025·0 cites·6 claims
- 3654US11036893B2Data retention methodWALTON ADVANCED ENG INC·Filed 2019·Granted Jun 15, 2021·0 cites·8 claims
- 3754US2024047375A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3854US2024063138A1Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3954US2025372562A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4054US2025379178A1Module containing fan-out wafer-level packaging (fowlp) unit connected to electronic component by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4154US2023411317A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4254US2023395537A1Bump of chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4354US2024021552A1Chip package unit, method of manufacturing the same, and package structure formed by stacking the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4454US2025391799A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4553US2024323153A1Method for high-security network message transmissionWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4653US2014122871A1Security information sharing system and execution method thereofWALTON ADVANCED ENG INC·Filed 2012·Application pending·0 cites
- 4752US2025349768A1Module containing fan-out wafer-level packaging unit connected to electronic by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4852US2025349783A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4951US9332059B2Method of file sharingWALTON ADVANCED ENG INC·Filed 2014·Granted May 3, 2016·0 cites·8 claims
- 5051US8514559B2Screen storage deviceYU HONG-CHI·Filed 2011·Granted Aug 20, 2013·2 cites·7 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →