Inventor · disambiguated record
Ho-Chieh Yu
Also filed as: YU HO-CHIEH
6 granted patents·3 pending applications·6 citations·filing 2004–2023
70Inventor score
Top patents by PatentIndex Score
9 records- 0174US10743411B1Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the componentICP TECH CO LTD·Filed 2020·Granted Aug 11, 2020·1 cites·8 claims
- 0263US11043911B2Motor control device with built-in current sensing resistor and power transistorICP TECH CO LTD·Filed 2019·Granted Jun 22, 2021·1 cites·8 claims
- 0354US7733620B2Chip scale gas discharge protective device and fabrication method of the sameTA I TECHNOLOGY CO LTD·Filed 2007·Granted Jun 8, 2010·4 cites·9 claims
- 0453US12463188B2Flip-chip packaged power transistor module having built-in gate driverICP TECH CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·7 claims
- 0553US2025132233A1Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissipation Ceramic Substrates and Manufacturing method of the SameICP TECH CO LTD·Filed 2023·Application pending·0 cites
- 0647US2024114614A1Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor EmbeddedICP TECH CO LTD·Filed 2022·Application pending·0 cites
- 0741US2005201919A1Materials for cathode in solid oxide fuel cellsUNIV NAT CHENG KUNG·Filed 2004·Application pending·0 cites
- 0840US10524349B2Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the boardICP TECH CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·7 claims
- 0928US8072730B2Chip-type protection device having enclosed micro-gap between electrodesYU HO-CHIEH·Filed 2009·Granted Dec 6, 2011·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →