Inventor · disambiguated record
Hsiao-Lu Chen
Also filed as: CHEN HSIAO-LU
4 granted patents·7 pending applications·0 citations·filing 2022–2024
51Inventor score
Files withINGENTEC CORP11
Top patents by PatentIndex Score
11 records- 0161US2025267982A1Vertical light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0261US2025287727A1Light emitting diode chip and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0356US12417964B2Via-filling method of through-glass via substrateINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 0455US2025233028A1Micro-led wafer testing device and micro-led wafer testing methodINGENTEC CORP·Filed 2024·Application pending·0 cites
- 0554US12418011B2Bonding and transferring method for die package structuresINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 0651US2024339579A1Light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0750US12489093B2Magnetic LED die transferring device and magnetic LED die transferring methodINGENTEC CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 0850US2023170434A1Vertical light-emitting diode and method for fabricating the sameINGENTEC CORP·Filed 2022·Application pending·0 cites
- 0949US2024304749A1Encapsulation process method for wafer-level light-emitting diode diesINGENTEC CORP·Filed 2023·Application pending·0 cites
- 1046US12150242B2LED circuit board structure and LED testing and packaging methodINGENTEC CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 1146US2024006557A1Led circuit board structure, led testing and packaging method and led pixel packageINGENTEC CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →