Inventor · disambiguated record
Hsin-Chi Chen
Also filed as: CHEN HSIN-CHI
136 granted patents·41 pending applications·508 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD120TRANMAX MACHINERY CO LTD29CHEN HSIN-CHI7TAIWAN SEMICONDUCTOR MFG6CORETRONIC CORP4
Top patents by PatentIndex Score
177 records- 0198US11855118B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0298US11482506B2Edge-trimming methods for wafer bonding and dicingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·8 cites·20 claims
- 0397US11462642B2Source/drain epitaxial layer profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·20 claims
- 0497US11373971B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·5 cites·20 claims
- 0597US9130072B1Backside illuminated image sensor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 8, 2015·27 cites·20 claims
- 0697USD476210SPneumatic toolTRANMAX MACHINERY CO LTD·Filed 2002·Granted Jun 24, 2003·78 cites·1 claims
- 0796US12027581B2Semiconductor device with air-void in spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0896US11784198B2Wide channel semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 0996US11756913B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·20 claims
- 1096US10790321B2CMOS image sensor having indented photodiode structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·6 cites·20 claims
- 1196US9799697B2Back side illuminated image sensor with deep trench isolation structures and self-aligned color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 24, 2017·13 cites·18 claims
- 1295US11211283B2Method for forming a bulk semiconductor substrate configured to exhibit soi behaviorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·3 cites·20 claims
- 1395US10790391B2Source/drain epitaxial layer profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·7 cites·20 claims
- 1495US10566361B2Wide channel gate structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·8 cites·20 claims
- 1594US11887987B2Semiconductor wafer with devices having different top layer thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 1694US11706525B2Image sensor including light shielding layer and patterned dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 1794US11532662B2Method of forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·2 cites·20 claims
- 1894US11183523B2CMOS image sensor having indented photodiode structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·4 cites·20 claims
- 1994US10181491B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·6 cites·20 claims
- 2094US9281338B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·10 cites·20 claims
- 2193US12068271B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·1 cites·20 claims
- 2293US11942547B2Source/drain epitaxial layer profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·20 claims
- 2393US10498947B2Image sensor including light shielding layer and patterned dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·6 cites·20 claims
- 2493US9543353B2Formation of buried color filters in a back side illuminated image sensor with an ONO-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 10, 2017·6 cites·20 claims
- 2592US12010826B2Semiconductor device having a butted contact and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·1 cites·20 claims
- 2692US10692826B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·8 cites·20 claims
- 2792US9368531B2Formation of buried color filters in a back side illuminated image sensor with an ono-like structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·9 cites·20 claims
- 2891US10263302B1Baffle structure for heat dissipationNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Apr 16, 2019·4 cites·10 claims
- 2991US9553118B2Formation of buried color filters in a back side illuminated image sensor using an etching-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·7 cites·20 claims
- 3091US2025365949A1Semiconductor device having non-continuous wall structure surrounding stacked gate structure including conductive layer disposed between segmented portions of the wall structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3190US11404537B2Semiconductor device with air-void in spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 3290US11189743B2Single photon avalanche diodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·19 claims
- 3390US10770502B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·3 cites·20 claims
- 3489US10943942B2Image sensor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 9, 2021·2 cites·20 claims
- 3589US7307230B2Mechanism for controlling circuit-closing/opening of power ratchet wrenchTRANMAX MACHINERY CO LTD·Filed 2006·Granted Dec 11, 2007·25 cites·5 claims
- 3688US9893107B2Semiconductor device with reduced leakage current and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·6 cites·20 claims
- 3788US9812488B2Backside illuminated image sensor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·6 cites·20 claims
- 3888US9419048B2Method of manufracturing structure of dielectric grid for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·2 cites·20 claims
- 3988US7186117B2Connection mechanism for battery pack and power toolsTRANMAX MACHINERY CO LTD·Filed 2005·Granted Mar 6, 2007·28 cites·15 claims
- 4087US12464714B2Semiconductor device having non-continuous wall structure surrounding a stacked gate structure including a conductive layer disposed between segmented portions of the wall structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 4187US12218173B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 4287US10672795B2Bulk semiconductor substrate configured to exhibit semiconductor-on-insulator behaviorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·4 cites·20 claims
- 4387US10163641B2Memory with a raised dummy feature surrounding a cell regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·5 cites·20 claims
- 4486US10269844B2Structure and formation method of light sensing deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·3 cites·20 claims
- 4585US11140309B2Image sensor including light shielding layer and patterned dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·19 claims
- 4685US10490590B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·2 cites·20 claims
- 4785US2025318289A1Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4884US12457816B2Wide channel semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 4984US11018179B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·1 cites·20 claims
- 5084US10086496B2Safety cover for sand grinderTRANMAX MACHINERY CO LTD·Filed 2017·Granted Oct 2, 2018·2 cites·5 claims
Showing the top 50 of 177 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →