Inventor · disambiguated record
Hsin-Ping Chen
Also filed as: CHEN HSIN · CHEN HSIN-PING
41 granted patents·26 pending applications·52 citations·filing 2006–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD59HON HAI PREC IND CO LTD6CHEN HSIN-PING1NAT APPLIED RES LABORATORIES1
Top patents by PatentIndex Score
67 records- 0198US11201106B2Semiconductor device with conductors embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·7 cites·20 claims
- 0291US11183422B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0391US11004740B2Structure and method for interconnection with self-alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·6 cites·20 claims
- 0489US11088020B2Structure and formation method of interconnection structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 10, 2021·7 cites·20 claims
- 0589US10991618B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·4 cites·20 claims
- 0689US10676351B2Nano-electromechanical system (NEMS) device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·3 cites·20 claims
- 0788US10504775B1Methods of forming metal layer structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·4 cites·20 claims
- 0886US10340181B2Interconnect structure including air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 2, 2019·4 cites·20 claims
- 0985US11764106B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·1 cites·20 claims
- 1082US11361994B2Fully self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·20 claims
- 1181US12230534B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 1281US10727113B2Methods of forming metal layer structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·2 cites·20 claims
- 1380US8008996B2Low-pass filterHON HAI PREC IND CO LTD·Filed 2008·Granted Aug 30, 2011·8 cites·8 claims
- 1480US2025343148A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1579US2024379434A1Fully Self-Aligned Interconnect StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1678US10000373B2Nano-electromechanical system (NEMS) device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 19, 2018·2 cites·20 claims
- 1778US2024339406A1Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1877US2025079298A1Hybrid metal line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1976US12183671B2Hybrid metal line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 2076US12136567B2Fully self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 2176US12094946B2Gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 2276US11848190B2Barrier-less structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·19 claims
- 2376US2025336807A1Metal lines of hybrid heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2475US10325993B2Gate all around device and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·1 cites·20 claims
- 2575US2024297077A1Semiconductor device with spacers for self aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2674US12062611B2Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·19 claims
- 2774US2024379537A1Semiconductor structure having deep metal line and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2873US12080593B2Barrier-less structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 2973US2025309041A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3073US2025140697A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3173US2024170403A1Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3271US11984359B2Semiconductor device with spacers for self aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 3371US11302792B2Fabrication of gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 3469US11923306B2Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 3568US12412804B2Semiconductor structure with improved heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 3668US12094816B2Semiconductor structure having deep metal line and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 3767US11682618B2Hybrid metal line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 3867US11640924B2Structure and method for interconnection with self-alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 3967US11167984B2Nano-electromechanical system (NEMS) device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 4064US10763337B2Fabrication of gate all around deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 4161US10804143B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 4261US10622453B2Vertical MOS transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 4360US11244898B2Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 4460US2025239449A1Semiconductor device structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4559US11264277B2Semiconductor device with spacers for self aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 4659US2025125251A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4758US2025174492A1Interconnection structure having air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4858US2025112088A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4958US2025125189A1Interconnect structure with reinforcing spacer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5058US2021057273A1Barrier-Less StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →