Inventor · disambiguated record

Hsiang-Fu Chen

Also filed as: CHEN HSIANG-FU · CHEN HSIANG-FU “BENIOR”

44 granted patents·16 pending applications·143 citations·filing 2003–2025

97Inventor score

Technology areasB81B B81C H10W H10D H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD50 SHU CHIA-PAO3 TAIWAN SEMICONDUCTOR MFG3 HUNG CHIA-MING1 IND TECH RES INST1

Top patents by PatentIndex Score

60 records

0197US9567204B2Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·18 cites·20 claims
0296US8716852B2Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the sameSHU CHIA-PAO·Filed 2012·Granted May 6, 2014·26 cites·20 claims
0395US10392244B2Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 27, 2019·9 cites·20 claims
0495US9656857B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·13 cites·20 claims
0592US10131540B2Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 20, 2018·9 cites·20 claims
0692US9365416B2Structure and method for motion sensorSHU CHIA-PAO·Filed 2012·Granted Jun 14, 2016·12 cites·31 claims
0790US11834332B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·1 cites·20 claims
0889US10556792B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·3 cites·20 claims
0989US9266714B2Micro-electro mechanical system (MEMS) structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·6 cites·20 claims
1089US2025122071A1Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1188US12015001B2Bonding structure and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·1 cites·20 claims
1287US10961118B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
1387US9845236B2Monolithic MEMS platform for integrated pressure, temperature, and gas sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·4 cites·20 claims
1487US8878312B2Electrical bypass structure for MEMS deviceHUNG CHIA-MING·Filed 2011·Granted Nov 4, 2014·16 cites·15 claims
1586US12215016B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
1686US9630832B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·6 cites·20 claims
1785US9202792B2Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 1, 2015·7 cites·18 claims
1882US2025333295A1Micro-electromechanical systems (mems) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1981US11834325B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
2081US11491510B2Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·1 cites·20 claims
2181US2024383005A1Semiconductor device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2280US12162749B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
2379US2025338516A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2479US2024375943A1Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2578US2025250163A1A semiconductor device comprising different types of microelectromechanical systems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2677US10266396B2MEMS device with enhanced sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
2776US12304807B2Semiconductor device comprising different types of microelectromechanical systems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
2876US9856139B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·1 cites·20 claims
2974US12491536B2Semiconductor device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·12 claims
3074US12257602B2Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
3174US2025329594A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3274US2025214108A1Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3374US2024304580A1Bonding structure and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3473US9776858B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
3573US2024395897A1Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3671US12269735B2Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
3771US10464808B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
3871US9422151B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·1 cites·20 claims
3971US2025316540A1Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4070US12441604B2Micro-electromechanical systems (MEMS) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
4170US11365115B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·20 claims
4269US10899608B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
4368US12507426B2Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
4468US8723280B2Hybrid MEMS bump design to prevent in-process and in-use stictionSHU CHIA-PAO·Filed 2012·Granted May 13, 2014·2 cites·20 claims
4567US12362240B2Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
4665US12479719B2MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
4765US12400926B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
4863US10981781B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
4960US2025058353A1Semiconductor ultrasonic transducer device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
5055US2025208445A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 60 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Hsiang-Fu Chen files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →