Inventor · disambiguated record
Hsu-Hsien Chen
Also filed as: CHEN HSU-HSIEN
12 granted patents·10 pending applications·254 citations·filing 2012–2025
91Inventor score
Top patents by PatentIndex Score
22 records- 0198US8975726B2POP structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 10, 2015·140 cites·17 claims
- 0295US9490167B2Pop structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·12 cites·20 claims
- 0394US8653626B2Package structures including a capacitor and methods of forming the sameLO SUT-I·Filed 2012·Granted Feb 18, 2014·51 cites·19 claims
- 0493US9478474B2Methods and apparatus for forming package-on-packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 25, 2016·18 cites·20 claims
- 0591US9576821B2Package structures including a capacitor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·13 cites·19 claims
- 0688US9406629B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·8 cites·12 claims
- 0787US11315860B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·5 cites·20 claims
- 0883US10535593B2Package structure having a plurality of conductive balls with narrow width for ball waistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·3 cites·20 claims
- 0978US2025357215A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1078US2025357224A1Device package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1177US2025349624A1Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1276US10037973B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 1375US10276481B2Package structure having a plurality of conductive balls having narrow width for the ball waistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 1473US2025316569A1Surface treatment in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1570US2025266303A1Device package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1669US12451396B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1769US2025062201A1Surface treatment in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1868US11742276B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1966US2024153821A1Package structure having a stacked semiconductor dies with wavy sidewalls and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2060US2025372536A1Back-side warpage control layer to improve bonding bulge / non-bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025349811A1Semiconductor module including a corner die over a side of a semiconductor die, package structure including the semiconductor module and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2254US2024112924A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →