Inventor · disambiguated record
Hsien-Wen Chen
Also filed as: CHEN HSIEN-WEN
13 granted patents·10 pending applications·41 citations·filing 2011–2018
88Inventor score
Top patents by PatentIndex Score
23 records- 0191US9818683B2Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 14, 2017·9 cites·12 claims
- 0290US9502335B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·13 cites·26 claims
- 0385US10199320B2Method of fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 5, 2019·4 cites·13 claims
- 0483US9875949B2Electronic package having circuit structure with plurality of metal layers, and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jan 23, 2018·5 cites·24 claims
- 0582US9058971B2Electro-optical moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 16, 2015·7 cites·23 claims
- 0662US9627307B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Apr 18, 2017·1 cites·10 claims
- 0753US10403596B2Method of fabricating packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 0853US8970053B2Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UMWANG YUEN-HAN·Filed 2012·Granted Mar 3, 2015·2 cites·20 claims
- 0951US9748183B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 29, 2017·0 cites·11 claims
- 1049US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1146US9196596B2Interposer and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 24, 2015·0 cites·17 claims
- 1246US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1345US2016163632A1Packaging structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 1442US2013026516A1Light-emitting diode (led) package structure and packaging method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 1541US10049973B2Electronic package and fabrication method thereof and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 14, 2018·0 cites·10 claims
- 1641US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1739US10249562B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Apr 2, 2019·0 cites·20 claims
- 1834US8486733B2Package having light-emitting element and fabrication method thereofLIOU JIA-SHIN·Filed 2011·Granted Jul 16, 2013·0 cites·9 claims
- 1934US2016049359A1Interposer with conductive post and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2034US2016148873A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2133US2016307833A1Electronic packaging structure and method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2233US2016086903A1Semiconductor structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2326US2013175563A1Led chip structure, packaging substrate, package structure and fabrication method thereofWANG YUEN-HAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →