Inventor · disambiguated record
Hsien-Wei Chen
Also filed as: CHEN HSIEN-WEI
873 granted patents·153 pending applications·5,623 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD812TAIWAN SEMICONDUCTOR MFG107CHEN HSIEN-WEI39ACER INC14JENG SHIN-PUU4
Top patents by PatentIndex Score
1,026 records- 0199US11908836B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·6 cites·20 claims
- 0299US11721559B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·4 cites·20 claims
- 0399US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0499US11482649B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·9 cites·20 claims
- 0599US11444021B2Device and package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·5 cites·20 claims
- 0699US11404404B2Semiconductor structure having photonic die and electronic dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·6 cites·20 claims
- 0799US11362065B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·8 cites·14 claims
- 0899US11347001B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·6 cites·20 claims
- 0999US11315855B2Package structure with photonic die and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·11 cites·20 claims
- 1099US11276656B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·12 cites·20 claims
- 1199US11145622B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 12, 2021·5 cites·20 claims
- 1299US10658337B2Packages and packaging methods for semiconductor devices, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·37 cites·20 claims
- 1399US10510650B2Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·67 cites·20 claims
- 1499US10510629B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·38 cites·20 claims
- 1599US10504852B1Three-dimensional integrated circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·45 cites·19 claims
- 1699US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 1799US10037963B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·56 cites·20 claims
- 1899US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 1999US9859245B1Chip package structure with bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·48 cites·20 claims
- 2099US9812337B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·66 cites·20 claims
- 2199US9768133B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·45 cites·20 claims
- 2299US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 2399US9666502B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·684 cites·20 claims
- 2499US9613931B2Fan-out stacked system in package (SIP) having dummy dies and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·64 cites·19 claims
- 2599US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 2698US12261163B2Molded dies in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·4 cites·18 claims
- 2798US11908692B2Method for fabricating a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·4 cites·20 claims
- 2898US11728247B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·4 cites·14 claims
- 2998US11456240B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 3098US11424191B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 3198US11387209B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 3298US11380598B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 3398US11362066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·5 cites·20 claims
- 3498US11362069B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 3598US11342297B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 3698US11309223B2Method of forming semiconductor device package having dummy devices on a first dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·7 cites·20 claims
- 3798US11264343B2Bond pad structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·5 cites·20 claims
- 3898US10840190B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·24 cites·20 claims
- 3998US10504873B13DIC structure with protective structure and method of fabricating the same and packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·24 cites·20 claims
- 4098US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 4198US10290571B2Packages with si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·23 cites·20 claims
- 4298US10163802B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·76 cites·20 claims
- 4398US10157867B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·39 cites·20 claims
- 4498US10090284B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·43 cites·20 claims
- 4598US10074618B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·19 cites·20 claims
- 4698US9922964B1Package structure with dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·23 cites·20 claims
- 4798US9859258B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·40 cites·20 claims
- 4898US9825007B1Chip package structure with molding layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·21 cites·17 claims
- 4998US9824990B2Pad design for reliability enhancement in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 21, 2017·20 cites·20 claims
- 5098US9735134B2Packages with through-vias having tapered endsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·58 cites·20 claims
Showing the top 50 of 1,026 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →