Inventor · disambiguated record
Hsueh-Lung Cheng
Also filed as: CHENG HSUEH-LUNG
6 granted patents·3 pending applications·11 citations·filing 2008–2025
72Inventor score
Top patents by PatentIndex Score
9 records- 0175US2025323217A1Integrated fan-out platform and manufacturing method for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0269US7755900B2Heat dissipating moduleAMA PRECISION INC·Filed 2008·Granted Jul 13, 2010·7 cites·11 claims
- 0366US12388047B2Integrated fan-out platform and manufacturing method for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 0465US7944688B2Heat dissipating structure including a position-adjusting unitAMA PRECISION INC·Filed 2008·Granted May 17, 2011·4 cites·9 claims
- 0551US9646928B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 9, 2017·0 cites·20 claims
- 0649US9812416B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·20 claims
- 0742US2009011131A1Method for treating surface of heat dissipating moduleAMA PRECISION INC·Filed 2008·Application pending·0 cites
- 0837US9839157B2Liquid cooling apparatusMSI COMPUTER (SHENZHEN) CO LTD·Filed 2015·Granted Dec 5, 2017·0 cites·13 claims
- 0930US2018098460A1Liquid cooling heat dissipation moduleMSI COMPUTER SHENZHEN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →