Inventor · disambiguated record
Hsi-Kuei Cheng
Also filed as: CHENG HSI-KUEI
47 granted patents·10 pending applications·179 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
57 records- 0197US9922896B1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·18 cites·20 claims
- 0293US10290530B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·6 cites·20 claims
- 0393US9209048B2Two step molding grinding for packaging applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
- 0490US10529697B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·5 cites·19 claims
- 0589US10522526B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·5 cites·20 claims
- 0688US10128182B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 0787US10692809B2Manufacturing method for semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 0887US7432192B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 7, 2008·11 cites·20 claims
- 0986US10546845B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·3 cites·20 claims
- 1085US12334489B2Lthc as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 1183US12261074B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1282US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1382US10090267B2Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·5 cites·20 claims
- 1482US2025201617A1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1582US2024355795A1Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1681US7030016B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 18, 2006·22 cites·37 claims
- 1780US11437361B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·20 claims
- 1880US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
- 1980US9735123B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·5 cites·20 claims
- 2079US10163843B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 2178US11923353B2LTHC as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 2277US9997482B2Solder stud structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 12, 2018·4 cites·20 claims
- 2376US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 2475US12046588B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 2575US11984342B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2674US11948881B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 2772US9806046B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·20 claims
- 2871US11990454B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 21, 2024·0 cites·19 claims
- 2971US6482290B1Sweeping slurry dispenser for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·19 cites·15 claims
- 3070US11404341B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 3170US11069614B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 3265US10950478B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 3365US10290590B2Stacked semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·18 claims
- 3464US11257797B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 3564US7026233B2Method for reducing defects in post passivation interconnect processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·12 cites·25 claims
- 3663US6585826B2Semiconductor wafer cleaning method to remove residual contamination including metal nitride particlesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 1, 2003·10 cites·7 claims
- 3762US2024266336A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3861US10867973B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3960US7256120B2Method to eliminate plating copper defectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 14, 2007·8 cites·17 claims
- 4059US11217548B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·0 cites·20 claims
- 4156US8993393B2Multiple silicide integration structure and methodYEH DER-CHYANG·Filed 2010·Granted Mar 31, 2015·1 cites·20 claims
- 4254US11145613B2Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 12, 2021·0 cites·20 claims
- 4354US6695921B2Hoop support for semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 24, 2004·5 cites·13 claims
- 4453US2015262952A1Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 4552US6863491B2Catch-pin water support for process chamberTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 8, 2005·4 cites·19 claims
- 4652US2018033756A1Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 4748US9391067B2Multiple silicide integration structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 12, 2016·0 cites·20 claims
- 4848US6985222B2Chamber leakage detection by measurement of reflectivity of oxidized thin filmTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 10, 2006·0 cites·32 claims
- 4945US9779969B2Package structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·0 cites·20 claims
- 5045US7667835B2Apparatus and method for preventing copper peeling in ECPTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 23, 2010·0 cites·15 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →