Inventor · disambiguated record
Hsiang-Yi Cheng
Also filed as: CHENG HSIANG-YI
2 granted patents·3 pending applications·4 citations·filing 2014–2022
41Inventor score
Files withTU BO2DONGGUAN MEISHENG ELECTRICAL PRODUCTS CO LTD1FLYTECH TECHNOLOGY CO LTD1SHENZHEN JIEJIANDA INNOVATION TECH CO LTD1
Top patents by PatentIndex Score
5 records- 0182US11909709B1Identifying serially-connected power over ethernet (PoE) networked devicesFLYTECH TECHNOLOGY CO LTD·Filed 2022·Granted Feb 20, 2024·4 cites·10 claims
- 0234US10665563B2Semiconductor chip packaging structure without soldering wire, and packaging method thereofSHENZHEN JIEJIANDA INNOVATION TECH CO LTD·Filed 2018·Granted May 26, 2020·0 cites·13 claims
- 0334US2022085188A1Stacked semiconductor chip structure and its processTU BO·Filed 2020·Application pending·0 cites
- 0430US2020105736A13D Stacked and Encapsulated LED Display Screen Module and Its Encapsulation MethodTU BO·Filed 2019·Application pending·0 cites
- 0528US2015241002A1Strong light light-emitting diode (led) light source module and production process thereofDONGGUAN MEISHENG ELECTRICAL PRODUCTS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →