Inventor · disambiguated record
Hsu Chiang
Also filed as: CHIANG HSU · CHIANG HSU-CHIH
15 granted patents·20 pending applications·50 citations·filing 2012–2025
89Inventor score
Files withNANYA TECHNOLOGY CORP16INOTERA MEMORIES INC10MICRON TECHNOLOGY INC7CHIANG HSU-CHIH1PHISON ELECTRONICS CORP1
Top patents by PatentIndex Score
35 records- 0196US9520333B1Wafer level package and fabrication method thereofINOTERA MEMORIES INC·Filed 2015·Granted Dec 13, 2016·28 cites·13 claims
- 0291US10566229B2Microelectronic package structures including redistribution layersMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 18, 2020·6 cites·15 claims
- 0383US10811420B2Semiconductor structure and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Oct 20, 2020·4 cites·15 claims
- 0483US2025240946A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0582US9748184B2Wafer level package with TSV-less interposerMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 29, 2017·4 cites·10 claims
- 0679US2025240944A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0779US2025240943A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0878US2025344367A1Semiconductor device including double side word line and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0977US2025344366A1Semiconductor device including double side word line and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1073US9043549B2Memory storage apparatus, memory controller, and method for transmitting and identifying data streamCHIANG HSU-CHIH·Filed 2012·Granted May 26, 2015·6 cites·18 claims
- 1172US2025240948A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1269US2025240947A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1367US10818536B2Microelectronic devices including redistribution layersMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 27, 2020·0 cites·20 claims
- 1466US9070782B2Semiconductor structureINOTERA MEMORIES INC·Filed 2013·Granted Jun 30, 2015·2 cites·10 claims
- 1564US11450553B2Semiconductor structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 20, 2022·0 cites·4 claims
- 1664US2025393186A1Semiconductor device and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1763US2022384246A1Method of forming semiconductor structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1862US2025280525A1Memory device and fabricating method thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1960US2025176244A1Semiconductor structure including a bit line structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2059US2025280584A1Semiconductor memory device manufacturing methodNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2159US2025248054A1Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2255US11062984B2Methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 13, 2021·0 cites·19 claims
- 2352US9916999B2Methods of fabricating a semiconductor package structure including at least one redistribution layerMICRON TECHNOLOGY INC·Filed 2015·Granted Mar 13, 2018·0 cites·16 claims
- 2449US10121734B2Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 6, 2018·0 cites·20 claims
- 2544US9772937B2Data processing method, memory controller and memory storage apparatusPHISON ELECTRONICS CORP·Filed 2013·Granted Sep 26, 2017·0 cites·18 claims
- 2644US9070740B2Memory unit, memory unit array and method of manufacturing the sameINOTERA MEMORIES INC·Filed 2013·Granted Jun 30, 2015·0 cites·10 claims
- 2744US2015348871A1Semiconductor device and method for manufacturing the sameINOTERA MEMORIES INC·Filed 2014·Application pending·0 cites
- 2843US2015076666A1Semiconductor device having through-silicon viaINOTERA MEMORIES INC·Filed 2013·Application pending·0 cites
- 2943US2015243597A1Semiconductor device capable of suppressing warpingINOTERA MEMORIES INC·Filed 2014·Application pending·0 cites
- 3041US9035366B2Semiconductor device and manufacturing method thereforINOTERA MEMORIES INC·Filed 2013·Granted May 19, 2015·0 cites·10 claims
- 3140US9496358B2Semiconductor device and fabrication method thereforINOTERA MEMORIES INC·Filed 2014·Granted Nov 15, 2016·0 cites·5 claims
- 3240US2014252550A1Stack capacitor structure and manufacturing method thereofINOTERA MEMORIES INC·Filed 2013·Application pending·0 cites
- 3340US2020152639A1Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 3436US2018190761A1Mim capacitor with enhanced capacitanceMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 3534US2017012028A1Recoverable device for memory base productINOTERA MEMORIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →