Inventor · disambiguated record
Hsiu-Fang Chien
Also filed as: CHIEN HSIU-FANG
4 granted patents·8 pending applications·2 citations·filing 2005–2025
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0187US12154848B2Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·8 claims
- 0268US2025038097A1Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0364US2025126702A1Carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0462US12219693B2Carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·11 claims
- 0561US12278173B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 0657US2025201695A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0752US2025167162A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0851US11437325B2Electronic device, electronic package and packaging substrate thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·18 claims
- 0950US2025125243A1Chip carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1049US2024395687A1Electronic package and carrier structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1146US2024266302A1Carrier substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1232US2006076695A1Semiconductor package with flash-absorbing mechanism and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →