Inventor · disambiguated record
Hsien-Wei Chiu
Also filed as: CHIU HSIEN-WEI
0 granted patents·4 pending applications·0 citations·filing 2023–2025
Files withIND TECH RES INST4
Top patents by PatentIndex Score
4 records- 0158US2025219033A1Hybrid bonding structure and display panelIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0256US2024130657A1Physiological sensing deviceIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0355US2024088004A1Stacked wiring structureIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0450US2025247957A1Circuit substrate and method for fabricating the sameIND TECH RES INST·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →