Inventor · disambiguated record
Hsin-Lung Chung
Also filed as: CHUNG HSIN-LUNG
19 granted patents·7 pending applications·43 citations·filing 2010–2018
91Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD20FANG HAO-JU2TSAI TSUNG-HSIEN2CHEN CHING-HUA1HSU TSUNG-HSIEN1
Top patents by PatentIndex Score
26 records- 0187US8264070B2Package structure with ESD and EMI preventing functionsTSAI TSUNG-HSIEN·Filed 2010·Granted Sep 11, 2012·11 cites·11 claims
- 0284US9907186B1Electronic package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·23 claims
- 0380US8766416B2Semiconductor package and fabrication method thereofHSU TSUNG-HSIEN·Filed 2012·Granted Jul 1, 2014·9 cites·9 claims
- 0479US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
- 0579US9508656B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·8 claims
- 0677US9111945B2Package having ESD and EMI preventing functions and fabrication method thereofTSAI TSUNG-HSIEN·Filed 2011·Granted Aug 18, 2015·4 cites·12 claims
- 0773US10566320B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 18, 2020·2 cites·6 claims
- 0866US9899335B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·1 cites·7 claims
- 0962US9257394B2Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 9, 2016·2 cites·20 claims
- 1057US8618655B2Carrier-free semiconductor packageCHEN CHING-HUA·Filed 2011·Granted Dec 31, 2013·1 cites·7 claims
- 1154US2014203771A1Electronic package, fabrication method thereof and adhesive compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1252US8962396B2Fabrication method of carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 24, 2015·0 cites·11 claims
- 1351US9337250B2Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 10, 2016·0 cites·3 claims
- 1449US10074613B2Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims
- 1549US9502758B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·0 cites·24 claims
- 1647US9997477B2Method of manufacturing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·4 claims
- 1747US9490219B2Semiconductor package with shielding member and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·0 cites·16 claims
- 1846US10062582B2Fabrication method of package having ESD and EMI preventing functionsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 28, 2018·0 cites·14 claims
- 1946US9343401B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·0 cites·18 claims
- 2042US9526171B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 20, 2016·0 cites·11 claims
- 2137US2012235259A1Semiconductor package and method of fabricating the sameFANG HAO-JU·Filed 2011·Application pending·0 cites
- 2236US2018247886A1Electronic package structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2335US2018096967A1Electronic package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2435US2014264958A1Semiconductor package, fabrication method thereof and molding compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2532US2016081234A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2632US2012170162A1Semiconductor package and fabrication method thereofFANG HAO-JU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →