Inventor · disambiguated record
Hsu-Nan Fang
Also filed as: FANG Hsu-Nan
30 granted patents·7 pending applications·43 citations·filing 2017–2024
94Inventor score
Top patents by PatentIndex Score
37 records- 0197US11276661B2Package structure including two joint structures including different materials and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·14 cites·20 claims
- 0292US10593630B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 17, 2020·8 cites·20 claims
- 0387US11139252B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 5, 2021·2 cites·20 claims
- 0484US11710675B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 25, 2023·1 cites·14 claims
- 0582US12249578B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 11, 2025·1 cites·5 claims
- 0682US10475775B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·4 cites·18 claims
- 0781US11538778B2Semiconductor package including alignment material and method for manufacturing semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 27, 2022·1 cites·16 claims
- 0879US11605597B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 14, 2023·1 cites·17 claims
- 0979US2025062174A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1078US12136579B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Nov 5, 2024·0 cites·13 claims
- 1178US10886223B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 5, 2021·2 cites·20 claims
- 1276US11316274B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 26, 2022·2 cites·15 claims
- 1376US10797022B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 1472US12142576B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Nov 12, 2024·0 cites·16 claims
- 1570US12165982B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 10, 2024·0 cites·17 claims
- 1670US11282778B2Interposer between a conductive substrate and plurality of semiconductor componentsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 22, 2022·1 cites·21 claims
- 1769US11139268B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·1 cites·19 claims
- 1869US10804172B2Semiconductor package device with thermal conducting material for heat dissipationADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 13, 2020·1 cites·19 claims
- 1968US11211319B2Device structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 28, 2021·1 cites·19 claims
- 2062US11133284B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 28, 2021·1 cites·22 claims
- 2159US11791434B2Electronic package, optoelectronic package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·0 cites·14 claims
- 2259US11404380B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 2354US11282772B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 22, 2022·0 cites·15 claims
- 2452US2025132278A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2551US11195771B2Substrate structure of semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 7, 2021·0 cites·19 claims
- 2651US2025087621A1Interposer structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2750US11257776B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 2849US11257788B2Semiconductor device package with stacked die having traces on lateral surfaceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·0 cites·21 claims
- 2948US11217498B2Semiconductor package and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·11 claims
- 3045US11502024B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 15, 2022·0 cites·14 claims
- 3144US10573572B2Electronic device and method for manufacturing a semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 25, 2020·0 cites·18 claims
- 3244US2021159188A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 3343US10943843B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 9, 2021·0 cites·19 claims
- 3443US2021111139A1Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 3543US2022189911A1Automated-position-aligning method for transferring chip and system using the methodWU YU JUNG·Filed 2021·Application pending·0 cites
- 3639US10797019B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 6, 2020·0 cites·15 claims
- 3739US2020402958A1Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →