Inventor · disambiguated record
Hsin-Ying Ho
Also filed as: HO HSIN-YING
27 granted patents·15 pending applications·27 citations·filing 2008–2025
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG27TAIWAN SEMICONDUCTOR MFG CO LTD9SUN CHING-CHERNG3ADVANCED SEMICONDUCTORY ENGINEERING INC1HO WU-CHI1
Top patents by PatentIndex Score
42 records- 0195US11892346B2Optical system and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 6, 2024·2 cites·6 claims
- 0295US11276806B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·4 cites·22 claims
- 0386US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0486US9911877B2Electronic device, package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 6, 2018·5 cites·18 claims
- 0585US11287312B2Optical system and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 29, 2022·3 cites·20 claims
- 0683US12379243B2Optical system and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0783US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0883US11257799B2Optical sensor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·3 cites·20 claims
- 0982US2025308928A1Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1078US12300508B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1174US10752494B2Semiconductor device packageADVANCED SEMICONDUCTORY ENGINEERING INC·Filed 2018·Granted Aug 25, 2020·1 cites·27 claims
- 1272US10436635B2Active optical component with passive optical component and encapsulant for an optical device and electrical device including the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 8, 2019·2 cites·16 claims
- 1371US11373879B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 1468US10770624B2Semiconductor device package, optical package, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 1568US10069051B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 4, 2018·1 cites·20 claims
- 1666US10424566B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 24, 2019·1 cites·19 claims
- 1764US11189727B2FinFET contacts and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·1 cites·20 claims
- 1862US9862799B2Polymer particle and preparation method thereofMAY-HWA ENTPR CORPORATION·Filed 2014·Granted Jan 9, 2018·1 cites·14 claims
- 1961US10777423B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 2060US11892570B2Optical assembly that generates distinctive irradiance pattern of lightADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·0 cites·19 claims
- 2160US2021183839A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 2259US2025107298A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2359US2025048760A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2458US2024237907A1Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2556US2024219524A1Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 2656US2009322026A1LED Chess SetSUN CHING-CHERNG·Filed 2008·Application pending·0 cites
- 2755US11626441B2Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 2855US10629787B2Lid and an optical device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 21, 2020·0 cites·5 claims
- 2954US2025233068A1Semiconductor device, wiring structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3053US11588081B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 3151US11551963B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 3249US10910532B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 2, 2021·0 cites·22 claims
- 3349US2009279053A1Apparatus for Continuously Projecting Images and Method thereforSUN CHING-CHERNG·Filed 2008·Application pending·0 cites
- 3448US2018017741A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
- 3547US10686105B2Optical package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 16, 2020·0 cites·21 claims
- 3646US2017319432A1Press needles with an alignment structureHO WU-CHI·Filed 2017·Application pending·0 cites
- 3744US2016307881A1Optical sensor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 3844US2009272990A1Light Mixing Apparatus for Light Emitting DiodeSUN CHING-CHERNG·Filed 2008·Application pending·0 cites
- 3943US2020020827A1Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 4042US11217479B2Multiple metallization schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 4141US2018315894A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 4239US10862014B2Optical device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 8, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →