Inventor · disambiguated record
Hsuan Chao Hou
Also filed as: HOU HSUAN CHAO
1 granted patent·1 pending application·1 citations·filing 2021–2023
17Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC2
Top patents by PatentIndex Score
2 records- 0180US11862607B2Composite dielectric structures for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·1 cites·20 claims
- 0266US2024145436A1Composite dielectric structures for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →