Inventor · disambiguated record
Hsing-Kuo Hsia
Also filed as: HSIA HSING-KUO
81 granted patents·69 pending applications·411 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD112TSMC SOLID STATE LIGHTING LTD8HSIA HSING-KUO7EPISTAR CORP5LI ZHEN-YU4
Top patents by PatentIndex Score
150 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 0399US10162139B1Semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·96 cites·20 claims
- 0498US12092861B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 17, 2024·8 cites·20 claims
- 0598US11973074B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 30, 2024·4 cites·20 claims
- 0698US11715728B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 1, 2023·6 cites·20 claims
- 0798US11362077B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 14, 2022·4 cites·20 claims
- 0898US10267990B1Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·33 cites·20 claims
- 0997US12038599B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·3 cites·20 claims
- 1097US11796735B2Integrated 3DIC with stacked photonic dies and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·3 cites·20 claims
- 1197US11747563B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 1297US11605621B2Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 14, 2023·3 cites·20 claims
- 1397US11592618B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 1497US10867982B1Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·14 cites·20 claims
- 1597US8241932B1Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2011·Granted Aug 14, 2012·49 cites·20 claims
- 1696US10866373B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·9 cites·20 claims
- 1796US10371893B2Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·14 cites·20 claims
- 1895US10746923B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·14 cites·20 claims
- 1994US12455420B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·2 cites·20 claims
- 2094US11960122B2Devices, systems, and methods for optical signal processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 2194US8653542B2Micro-interconnects for light-emitting diodesHSIA HSING-KUO·Filed 2011·Granted Feb 18, 2014·19 cites·18 claims
- 2293US10481351B2Semicondcutor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
- 2392US10937736B2Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·8 cites·20 claims
- 2491US12007611B2Package structure having grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·1 cites·20 claims
- 2590US10996410B2Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·4 cites·20 claims
- 2689US12044892B2Package structure including photonic package and interposer having waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·1 cites·20 claims
- 2789US11156772B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 2889US2025316664A1Hybrid integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2988US12368146B2Hybrid integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 3088US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
- 3187US10930628B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 3287US8236584B1Method of forming a light emitting diode emitter substrate with highly reflective metal bondingCHEM CHYI SHYUAN·Filed 2011·Granted Aug 7, 2012·18 cites·20 claims
- 3387US2024385398A1Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3487US2025355169A1Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3586US11953725B2Grating coupler and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·1 cites·20 claims
- 3686US11454773B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 3785US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
- 3885US12135454B2Structure and process for photonic packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·20 claims
- 3985US10665560B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·3 cites·18 claims
- 4085US2025327985A1Package structure including photonic package and interposer having waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4184US12442978B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 4284US12242108B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4384US8598617B2Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2012·Granted Dec 3, 2013·6 cites·20 claims
- 4483US12379556B2Package structure having grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 4583US12068297B2Hybrid integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 4683US2025306301A1Manufacturing method of package structure having grating couplerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4783US2024385377A1Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4883US2025314826A1Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4983US2025347854A1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5083US2025314819A1Structure and process for photonic packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 150 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →