Inventor · disambiguated record
Hsu-Liang Hsiao
Also filed as: HSIAO HSU-LIANG
15 granted patents·3 pending applications·59 citations·filing 2010–2024
90Inventor score
Files withADVANCED SEMICONDUCTOR ENG6FOCI FIBER OPTIC COMMUNICATIONS INC4WU MAO-JEN3CENTERA PHOTONICS INC1CT A PHOTONICS INC1
Top patents by PatentIndex Score
18 records- 0195US9905722B1Optical device, optical module structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 27, 2018·20 cites·22 claims
- 0290US11921334B2Alignment structure of optical elementFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Mar 5, 2024·2 cites·6 claims
- 0389US10177268B2Optical device, optical module structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 8, 2019·6 cites·21 claims
- 0484US9064988B2Photoelectric device packageCT A PHOTONICS INC·Filed 2012·Granted Jun 23, 2015·11 cites·8 claims
- 0581US2025115473A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0680US8666204B2Optical transmission moduleWU MAO-JEN·Filed 2011·Granted Mar 4, 2014·8 cites·20 claims
- 0775US12306448B2Alignment structure of optical elementFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2024·Granted May 20, 2025·0 cites·7 claims
- 0873US12168605B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 17, 2024·0 cites·16 claims
- 0971US8588559B2Optical coupler module having optical waveguide structureWU MAO-JEN·Filed 2011·Granted Nov 19, 2013·4 cites·18 claims
- 1070US8644654B2Optical coupler module having optical waveguide structureWU MAO-JEN·Filed 2011·Granted Feb 4, 2014·4 cites·20 claims
- 1169US8580589B1Wafer-level process for fabricating photoelectric modulesHSIAO HSU-LIANG·Filed 2012·Granted Nov 12, 2013·4 cites·17 claims
- 1259US11803015B2Optical probe for optoelectronic integrated circuitsFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Oct 31, 2023·0 cites·8 claims
- 1359US11014806B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 25, 2021·0 cites·17 claims
- 1453US11947172B2Optical probe package structureFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Apr 2, 2024·0 cites·9 claims
- 1544US9923103B2Detachable package structureCENTERA PHOTONICS INC·Filed 2015·Granted Mar 20, 2018·0 cites·12 claims
- 1640US10841679B2Microelectromechanical systems package structureADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 17, 2020·0 cites·36 claims
- 1739US2011049554A1Package base structure and manufacturing method thereofUNIV NAT CENTRAL·Filed 2010·Application pending·0 cites
- 1836US2012241600A1Optical electrical moduleLEE YUN-CHIH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →