Inventor · disambiguated record
Hsiu-Wen Hsu
Also filed as: HSU HSIU-WEN
48 granted patents·12 pending applications·64 citations·filing 1999–2024
96Inventor score
Files withSUPER GROUP SEMICONDUCTOR CO LTD20HSU HSIU-WEN15NIKO SEMICONDUCTOR CO LTD11EPISIL TECHNOLOGIES INC6GREAT POWER SEMICONDUCTOR CORP3
Top patents by PatentIndex Score
60 records- 0190US8872266B1Trench power MOSFET structure and fabrication method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2013·Granted Oct 28, 2014·10 cites·7 claims
- 0287US7994001B1Trenched power semiconductor structure with schottky diode and fabrication method thereofGREAT POWER SEMICONDUCTOR CORP·Filed 2010·Granted Aug 9, 2011·12 cites·18 claims
- 0380US7060567B1Method for fabricating trench power MOSFETEPISIL TECHNOLOGIES INC·Filed 2005·Granted Jun 13, 2006·9 cites·20 claims
- 0471US10529847B2Trench power semiconductor component and method of manufacturing the sameSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·18 claims
- 0571US10497782B2Trench power semiconductor component and method of manufacturing the sameSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2018·Granted Dec 3, 2019·2 cites·10 claims
- 0671US7084033B2Method for fabricating a trench power MOSFETEPISIL TECHNOLOGIES INC·Filed 2005·Granted Aug 1, 2006·5 cites·14 claims
- 0769US9837508B2Manufacturing method of trench power MOSFETSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2016·Granted Dec 5, 2017·1 cites·8 claims
- 0866US9536972B2Trench power MOSFET and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2015·Granted Jan 3, 2017·1 cites·8 claims
- 0966US9035378B2Trench power MOSFET structure fabrication methodSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2014·Granted May 19, 2015·1 cites·6 claims
- 1064US9349857B2Trench power MOSFET and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2015·Granted May 24, 2016·1 cites·9 claims
- 1163US8426275B2Fabrication method of trenched power MOSFETTU KOU-WAY·Filed 2011·Granted Apr 23, 2013·2 cites·26 claims
- 1262US8153490B2Fabrication method of power semiconductor structure with reduced gate impedanceHSU HSIU WEN·Filed 2010·Granted Apr 10, 2012·1 cites·9 claims
- 1361US9130035B2Trench power MOSFET and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2014·Granted Sep 8, 2015·1 cites·9 claims
- 1461US8569134B2Method to fabricate a closed cell trench power MOSFET structureHSU HSIU WEN·Filed 2012·Granted Oct 29, 2013·1 cites·6 claims
- 1561US2025366019A1Semiconductor device and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1660US8304828B2Closed cell trench power MOSFET structureHSU HSIU WEN·Filed 2010·Granted Nov 6, 2012·1 cites·5 claims
- 1758US8900950B2Trench power MOSFET structure with high cell density and fabrication method thereofHSU HSIU-WEN·Filed 2012·Granted Dec 2, 2014·1 cites·5 claims
- 1857US11049950B2Trench power seminconductor device and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·7 claims
- 1956US10680076B2Trench power semiconductor and method of making the sameSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·7 claims
- 2055US12446256B2Power device and method for manufacturing the sameNIKO SEMICONDUCTOR CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·9 claims
- 2153US10629452B2Manufacturing method of a chip package structureNIKO SEMICONDUCTOR CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·9 claims
- 2253US8114762B2Method for manufacturing trench MOSFET device with low gate chargeHSU HSIU-WEN·Filed 2009·Granted Feb 14, 2012·1 cites·10 claims
- 2352US7338852B2Method of forming a semiconductor device having a capacitor and a resistorEPISIL TECHNOLOGIES INC·Filed 2004·Granted Mar 4, 2008·4 cites·15 claims
- 2452US6806136B1Method of forming a semiconductor device having a capacitor and a resistorEPISIL TECHNOLOGIES INC·Filed 2004·Granted Oct 19, 2004·4 cites·31 claims
- 2551US10516027B2Trench power semiconductor and method of making the sameSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·8 claims
- 2651US10446658B2Trench power semiconductor device and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2017·Granted Oct 15, 2019·0 cites·5 claims
- 2751US8525256B2Power semiconductor structure with schottky diodeHSU HSIU WEN·Filed 2012·Granted Sep 3, 2013·0 cites·5 claims
- 2851US7592658B2Method of forming a semiconductor device having a capacitor and a resistorEPISIL TECHNOLOGIES INC·Filed 2008·Granted Sep 22, 2009·0 cites·28 claims
- 2949US10381268B2Fan-out wafer level chip package structureNIKO SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 13, 2019·0 cites·5 claims
- 3048US11289587B2Trench power semiconductor component and method of manufacturing the sameSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·11 claims
- 3148US9947551B2Chip package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·5 claims
- 3247US8981485B2Power transistor having a top-side drain and forming method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·12 claims
- 3347US8354315B2Fabrication method of a power semicondutor structure with schottky diodeGREAT POWER SEMICONDUCTOR CORP·Filed 2010·Granted Jan 15, 2013·0 cites·8 claims
- 3446US9299592B2Package structure and packaging method of wafer level chip scale packageHSIEH CHIH-CHENG·Filed 2014·Granted Mar 29, 2016·0 cites·9 claims
- 3545US9799563B2Fan-out wafer level chip package structure and manufacturing method thereofNIKO SEMICONDUCTOR CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·11 claims
- 3645US2012309177A1Trenched power semiconductor structure with reduced gate impedance and fabrication method thereofHSU HSIU WEN·Filed 2012·Application pending·0 cites
- 3744US7608511B1Fabrication method of trenched power MOSFET with low gate impedanceNIKO SEMICONDUCTOR CO LTD·Filed 2008·Granted Oct 27, 2009·0 cites·14 claims
- 3843US9876106B2Trench power transistor structure and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2016·Granted Jan 23, 2018·0 cites·15 claims
- 3943US2010244109A1Trenched metal-oxide-semiconductor device and fabrication thereofNIKO SEMICONDUCTOR CO LTD·Filed 2009·Application pending·0 cites
- 4042US8785277B2Method of manufacturing the trench power semiconductor structureHSU HSIU-WEN·Filed 2012·Granted Jul 22, 2014·0 cites·12 claims
- 4142US2009236636A1Closed Cell Array Structure Capable of Decreasing Area of non-well Junction RegionsHSU HSIU-WEN·Filed 2008·Application pending·0 cites
- 4242US2011266616A1Trenched power semiconductor structure with reduced gate impedance and fabrication method thereofHSU HSIU WEN·Filed 2010·Application pending·0 cites
- 4342US2009212355A1Metal-Oxide-Semiconductor Transistor Device and Method for Making the SameHSU HSIU-WEN·Filed 2008·Application pending·0 cites
- 4441US10559674B2Manufacturing method of a trench power semiconductor deviceSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·14 claims
- 4540US11049958B2Semiconductor power device and manufacturing method thereofSUPER GROUP SEMICONDUCTOR CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·10 claims
- 4640US2010176444A1Power mosfet and method of fabricating the sameNIKO SEMICONDUCTOR CO LTD·Filed 2009·Application pending·0 cites
- 4739US8846469B2Fabrication method of trenched power semiconductor device with source trenchYEH CHUN YING·Filed 2012·Granted Sep 30, 2014·0 cites·20 claims
- 4839US8716787B2Power semiconductor device and fabrication method thereofTANG SUNG-NIEN·Filed 2012·Granted May 6, 2014·0 cites·13 claims
- 4938US9337049B1Manufacturing method of wafer level chip scale package structureNIKO SEMICONDUCTOR CO LTD·Filed 2015·Granted May 10, 2016·0 cites·12 claims
- 5038US8729632B2Semiconductor structure with low resistance of substrate and low power consumptionHSU HSIU WEN·Filed 2011·Granted May 20, 2014·0 cites·12 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →