Inventor · disambiguated record
Hsi-Chang Hsu
Also filed as: HSU HSI-CHANG
11 granted patents·6 pending applications·27 citations·filing 2010–2023
85Inventor score
Top patents by PatentIndex Score
17 records- 0194US11610850B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·10 claims
- 0294US11532528B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·18 claims
- 0389US9040361B2Chip scale package with electronic component received in encapsulant, and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted May 26, 2015·13 cites·23 claims
- 0475US8828796B1Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 0573US12107055B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·10 claims
- 0665US11600571B2Electronic package, packaging substrate, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·23 claims
- 0765US8766456B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jul 1, 2014·2 cites·20 claims
- 0862US9397081B2Fabrication method of semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 19, 2016·1 cites·12 claims
- 0960US9177859B2Semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·10 claims
- 1055US10903167B2Electronic package, packaging substrate, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·9 claims
- 1152US2016005695A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1252US2019109092A1Positioning structure having positioning unitSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 1341US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1439US2014183721A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1538US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 1637US2012313243A1Chip-scale packageCHANG CHIANG-CHENG·Filed 2011·Application pending·0 cites
- 1736US2014042638A1Semiconductor package and method of fabricating the sameSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →