Inventor · disambiguated record

Hsaing-Pin Kuan

Also filed as: KUAN HSAING-PIN

3 granted patents·10 citations·filing 2019–2022

57Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD3

Top patents by PatentIndex Score

3 records

0191US10879192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·13 claims
0267US12512451B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
0346US11031376B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →