Inventor · disambiguated record
Hsuan-Ting Kuo
Also filed as: KUO HSUAN-TING
35 granted patents·37 pending applications·132 citations·filing 2013–2025
96Inventor score
Top patents by PatentIndex Score
72 records- 0198US9257333B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·77 cites·20 claims
- 0296US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 0391US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 0489US9437564B2Interconnect structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·11 cites·21 claims
- 0585US11585992B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 0685US11002927B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·3 cites·20 claims
- 0783US2025336786A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0882US9287203B2Package-on-package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·6 cites·20 claims
- 0982US2025316500A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1082US2025347870A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1181US10535644B1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 1281US9536865B1Interconnection joints having variable volumes in package structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 1381US2024274589A1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1480US10015888B2Interconnect joint protective layer apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 3, 2018·5 cites·20 claims
- 1580US2025070077A1Reflow method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1679US12009345B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1778US12417927B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1878US11874513B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 1978US2025349815A1Novel structure integrated with optical interface engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2078US2025349751A1Integrated circuit device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2177US12176319B2Reflow method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2277US11996400B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2377US2025343197A1Semiconductor package and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2476US10714442B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·1 cites·20 claims
- 2576US2025336678A1Wafer singulation including multiple laser groovingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676US2025336754A1Semiconductor package with thermal conductive structure and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775US2025372499A1Semiconductor packages and the manufacturing processes thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2875US2025093593A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2974US2025323041A1Wafer singulation including multiple laser groovingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3074US2025372497A1Semiconductor packages and the manufacturing processes thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3174US2024371813A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3274US2024389240A1Materials for semiconductor package mount applications and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3373US11043463B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·0 cites·20 claims
- 3473US9589862B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 7, 2017·3 cites·21 claims
- 3571US11545465B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 3671US2025087652A1Structure integrated with optical interface engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3771US2025149495A1Semiconductor package and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3870US12107064B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 3970US11342321B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 4070US2025062181A1Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4169US11610859B2Reflow method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
- 4269US9935044B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·1 cites·19 claims
- 4369US2022359356A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4467US12512451B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 4567US11830746B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 4667US2024107682A1Materials for semiconductor package mount applications and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4767US2024071952A1Integrated circuit device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4863US2025383260A1Inspection tool for fiber array unit (fau) quality monitoring in the co-packaged optics application and methods for inspecting using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4962US11664300B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 30, 2023·0 cites·20 claims
- 5062US10861827B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →