Inventor · disambiguated record
Hsin-Hsien Lee
Also filed as: LEE HSIN WU · LEE HSIN-HSIEN
4 granted patents·3 pending applications·7 citations·filing 2001–2025
64Inventor score
Top patents by PatentIndex Score
7 records- 0187US11315860B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·5 cites·20 claims
- 0274US2025316546A1Interposer including stepped surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0368US11742276B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 0465US12362246B2Interposer including stepped surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0564US9136442B2Multi-vertical LED packaging structureTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Sep 15, 2015·2 cites·18 claims
- 0632US2003048862A1Automatic calibration & synchronization for digital asynchronous communicationFiled 2001·Application pending·0 cites
- 0725US2002097859A1Communication peripheral apparatus automatic line searcherFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →