Inventor · disambiguated record
Hsiang-Fan Lee
Also filed as: LEE HSIANG-FAN
35 granted patents·4 pending applications·1,975 citations·filing 1997–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22TAIWAN SEMICONDUCTOR MFG14TZENG KUO-CHYUAN2UNITED INTEGRATED CIRCUITS CORP1
Top patents by PatentIndex Score
39 records- 0198US9281254B2Methods of forming integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1.8k cites·20 claims
- 0297US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
- 0396US9735082B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·19 claims
- 0496US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
- 0594US10770405B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·11 cites·20 claims
- 0694US10707177B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·11 cites·20 claims
- 0792US10629545B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·6 cites·20 claims
- 0892US10157813B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 0991US8748284B2Method of manufacturing decoupling MIM capacitor designs for interposersTZENG KUO-CHYUAN·Filed 2011·Granted Jun 10, 2014·13 cites·20 claims
- 1088US8716100B2Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layersTZENG KUO-CHYUAN·Filed 2011·Granted May 6, 2014·8 cites·20 claims
- 1187US9653427B2Integrated circuit package with probe pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·5 cites·20 claims
- 1286US9257409B2Decoupling MIM capacitor designs for interposers and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·5 cites·20 claims
- 1386US2024222218A13dic packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1485US9978660B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 22, 2018·5 cites·20 claims
- 1584US2025062250A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1682US11916023B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 1782US10629510B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 1880US12165990B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1980US9401395B2Decoupling MIM capacitor designs for interposers and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 26, 2016·2 cites·20 claims
- 2079US2024162166A1Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2177US11961779B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2275US7884408B2One-transistor random access memory technology compatible with metal gate processTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 8, 2011·4 cites·26 claims
- 2375US7271083B2One-transistor random access memory technology compatible with metal gate processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 18, 2007·15 cites·21 claims
- 2469US11587886B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 2569US11133237B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 2668US10867951B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 2768US9269762B2Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 23, 2016·1 cites·17 claims
- 2868US9263415B2Decoupling MIM capacitor designs for interposers and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·1 cites·20 claims
- 2967US7355240B2Semiconductor product including logic, non-volatile memory and volatile memory devices and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 8, 2008·3 cites·22 claims
- 3065US11037852B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 3158US8993405B2Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 31, 2015·0 cites·20 claims
- 3258US8994146B2Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 31, 2015·0 cites·20 claims
- 3354US6835640B2Method of forming a novel composite insulator spacerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 28, 2004·4 cites·21 claims
- 3448US10340242B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
- 3545US5926728AMethod for fabricating tungsten polycide contactsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jul 20, 1999·10 cites·19 claims
- 3644US2008217775A1Method of forming contact plugs for eliminating tungsten seam issueTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 3733US7101758B2Poly-etching method for split gate flash memory cellTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 5, 2006·0 cites·20 claims
- 3833US5946599AMethod of manufacturing a semiconductor IC deviceTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Aug 31, 1999·6 cites·4 claims
- 3931US6051463AMethod fabricating a data-storage capacitor for a dynamic random-access memory deviceUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Apr 18, 2000·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →