Inventor · disambiguated record
Hsiu-Jung Li
Also filed as: LI HSIU-JUNG
2 granted patents·3 pending applications·4 citations·filing 2013–2024
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0178US9524944B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 20, 2016·4 cites·9 claims
- 0264US2023230912A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 0352US2025183185A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0445US2024145398A1Carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 0539US9362245B2Package structure and fabrication method thereofYEH CHUN-WEI·Filed 2013·Granted Jun 7, 2016·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →