Inventor · disambiguated record
Hsiu Chi Liang
Also filed as: LIANG HSIU CHI
2 granted patents·1 pending application·0 citations·filing 2022–2023
22Inventor score
Files withGLOBALWAFERS CO LTD3
Top patents by PatentIndex Score
3 records- 0164US2024173819A1Wafer grinding parameter optimization method and electronic deviceGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 0253US12203871B2Ingot evaluation method and detecting apparatusGLOBALWAFERS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·13 claims
- 0338US12482677B2Wafer processing apparatus including rotatable element connected to pressure applying elementGLOBALWAFERS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →