Inventor · disambiguated record
Hsiao-Chung Liang
Also filed as: LIANG HSIAO-CHUNG
14 granted patents·1 pending application·58 citations·filing 2013–2025
90Inventor score
Top patents by PatentIndex Score
15 records- 0197US9093337B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·27 cites·20 claims
- 0295US10157881B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
- 0391US9484226B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·5 cites·20 claims
- 0490US11444002B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 0590US10510712B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
- 0687US9768142B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·20 claims
- 0782US9659891B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
- 0880US2025349572A1Pickup apparatus and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US12463067B2Pickup apparatus and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1071US10276531B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
- 1169US11749582B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 1268US10985135B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 1362US11233032B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·20 claims
- 1461US10804234B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 1555US10504870B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →