Inventor · disambiguated record
Hsien-Ken Liao
Also filed as: LIAO HSIEN-KEN
8 granted patents·2 pending applications·11 citations·filing 2014–2022
74Inventor score
Top patents by PatentIndex Score
10 records- 0186US9260298B1Stacked MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Feb 16, 2016·11 cites·17 claims
- 0254US11252511B2Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatusXMEMS LABS INC·Filed 2021·Granted Feb 15, 2022·0 cites·27 claims
- 0353US11805342B2Sound producing package structure and manufacturing method thereofXMEMS LABS INC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 0447US11758312B2Sound producing package structure and manufacturing method thereofXMEMS TAIWAN CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·26 claims
- 0543US9309108B2MEMS microphone packaging methodLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·0 cites·13 claims
- 0635US10362377B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
- 0734US10362406B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·12 claims
- 0834US10299046B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted May 21, 2019·0 cites·5 claims
- 0934US2018063616A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Application pending·0 cites
- 1032US2016157024A1Flip-chip mems microphoneLINGSEN PRECISION IND LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →