Inventor · disambiguated record
Hsiang Wan Liau
Also filed as: LIAU HSIANG WAN
3 granted patents·25 citations·filing 2006–2009
66Inventor score
Technology areasH10W
Files withADVANCED MICRO DEVICES INC3
Top patents by PatentIndex Score
3 records- 0187US7651938B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2006·Granted Jan 26, 2010·15 cites·18 claims
- 0283US7999394B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·10 cites·19 claims
- 0332US7482697B2Double-sided waffle packADVANCED MICRO DEVICES INC·Filed 2006·Granted Jan 27, 2009·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →