Inventor · disambiguated record
Hsiao-Chiang Lin
Also filed as: LIN HSIAO-CHIANG
4 granted patents·2 pending applications·0 citations·filing 2008–2024
52Inventor score
Top patents by PatentIndex Score
6 records- 0159US2025273472A1Semiconductor structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2024·Application pending·0 cites
- 0245US12341007B2Method of patterning underlying structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Granted Jun 24, 2025·0 cites·13 claims
- 0343US11143973B2Method for designing photomaskPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Oct 12, 2021·0 cites·6 claims
- 0443US2009311844A1Alignment mark and method for fabricating the same and alignment method of semiconductorPOWERCHIP SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 0530US10854555B1Method of manufacturing markPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 0630US9368396B1Gap fill treatment for via processPOWERCHIP TECHNOLOGY CORP·Filed 2015·Granted Jun 14, 2016·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →