Inventor · disambiguated record
Hsiao-Chu Lin
Also filed as: LIN HSIAO-CHU
8 granted patents·2 pending applications·74 citations·filing 2006–2024
85Inventor score
Top patents by PatentIndex Score
10 records- 0190US7705704B2Inductor structureVIA TECH INC·Filed 2008·Granted Apr 27, 2010·21 cites·16 claims
- 0289US7420452B1Inductor structureVIA TECH INC·Filed 2007·Granted Sep 2, 2008·19 cites·18 claims
- 0381US8081056B2Spiral inductorLEE SHENG-YUAN·Filed 2008·Granted Dec 20, 2011·11 cites·20 claims
- 0480US7663463B2Inductor structureVIA TECH INC·Filed 2007·Granted Feb 16, 2010·10 cites·20 claims
- 0579US7504923B1Inductor structureVIA TECH INC·Filed 2007·Granted Mar 17, 2009·9 cites·20 claims
- 0668US7477125B1Symmetrical inductor deviceVIA TECH INC·Filed 2008·Granted Jan 13, 2009·4 cites·15 claims
- 0768US2025122367A1Polymer composite, use thereof, low dielectric resin composition, prepreg, and metal foil laminated boardLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0843US12466919B2Polyamic acid, polyimide, and element formed therefromLCY CHEMICAL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·10 claims
- 0943US7405483B2Electronic assembly and circuit boardVIA TECH INC·Filed 2007·Granted Jul 29, 2008·0 cites·20 claims
- 1042US2008006950A1Bonding pad structure for electronic deviceVIA TECH INC·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsiao-Chu Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →