Inventor · disambiguated record
Hsien-Che Lin
Also filed as: LIN HSIEN-CHE
2 granted patents·4 citations·filing 2020–2023
45Inventor score
Technology areasH10W
Files withAPPLE INC2
Top patents by PatentIndex Score
2 records- 0193US11646302B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2020·Granted May 9, 2023·4 cites·30 claims
- 0269US12249599B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2023·Granted Mar 11, 2025·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →