Inventor · disambiguated record
Hsiu-Yung Lin
Also filed as: LIN HSIU-YUNG
2 granted patents·1 pending application·2 citations·filing 2021–2025
43Inventor score
Technology areasH10P
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0190US11961884B2Fill structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0279US12324199B2Fill structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0375US2025275194A1Fill Structures With Air GapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →