Inventor · disambiguated record
Hsuan-Yi Lin
Also filed as: LIN HSUAN-YI
3 granted patents·4 pending applications·2 citations·filing 2005–2022
50Inventor score
Files withAPAQ TECHNOLOGY CO LTD3MEDIATEK INC2ADVANCED GENE TECHNOLOGY CORP1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
7 records- 0167US9263542B2Semiconductor device having a charged insulating layerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·2 cites·14 claims
- 0253US12400944B2Board-level pad pattern for multi-row QFN packagesMEDIATEK INC·Filed 2022·Granted Aug 26, 2025·0 cites·16 claims
- 0350US12309921B2Board-level pad pattern for multi-row QFN packagesMEDIATEK INC·Filed 2022·Granted May 20, 2025·0 cites·16 claims
- 0439US2024105389A1Wound capacitor package structure and method of manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0537US2006263449A1Herbal composition for treatment of arthritic disorders, skin inflammatory disorders and painADVANCED GENE TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 0630US2018122579A1Wound capacitor package structure having conductive foils of unequal width and wound assembly thereofAPAQ TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 0730US2018122582A1Wound capacitor package structure without negative conductive foil and wound assembly thereofAPAQ TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →