Inventor · disambiguated record
Hsin Ting Lin
Also filed as: Lin Hsin Ting
3 granted patents·11 pending applications·6 citations·filing 2005–2025
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10SHENZHEN FULIAN FUGUI PREC INDUSTRY CO LTD2CHANG JU-NAN1SUNPLUS TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
14 records- 0188US11706901B2Immersion cooling systemSHENZHEN FULIAN FUGUI PREC INDUSTRY CO LTD·Filed 2022·Granted Jul 18, 2023·4 cites·10 claims
- 0277US2025357261A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0376US2025364362A1Hybrid Vapor Chamber LidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US2025349814A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0570US2025210608A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0670US2025323120A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0770US2025210451A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0870US2025246513A1Hybrid Vapor Chamber LidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0968US2025233046A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1061US7580615B2Method and apparatus for displaying multiple subtitles using sub-picture processingSUNPLUS TECHNOLOGY CO LTD·Filed 2005·Granted Aug 25, 2009·2 cites·16 claims
- 1157US2025329599A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1250US2024413121A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1348US11877382B2Immersion cooling system in miniaturized formSHENZHEN FULIAN FUGUI PREC INDUSTRY CO LTD·Filed 2022·Granted Jan 16, 2024·0 cites·10 claims
- 1435US2010309095A1Electronic apparatus having dual displaysCHANG JU-NAN·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsin Ting Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →